Mr. Sasada is a new associate at SUGIMURA. Prior to joining SUGIMURA, he serves as a project manager in the electronics packaging technologies field at Fujitsu and its affiliates. He located in San Jose, San Diego and Dallas in the States for technological management of global business for totally several years. He has particular expertise in the area of semiconductor package, ultra-high density PWB assembly and System in Package (SiP) for various mobile devices, radio frequency identification (RFID) and low power sensor network (ZigBee, etc.). He also serves as a committee member of the Printed Wiring Board WG to write “Japan Packaging Technology Roadmap” at Japan Electronics & Information Technology Industries Association (JEITA).
Japan Patent Attorneys Association (JPAA)
B.S., Electrical Engineering, Waseda University
Patent Prosecution (electrical engineering, Telecommunication, IT, IoT)