鹿山 昌代 / Masayo KAYAMA

登録

日本弁理士会

学歴

大阪府立大学大学院 工学研究科 電子物理工学専攻

主な業務分野

特許出願(電気・電子)

言語

日本語
英語

論文

-“Experimental and theoretical study on the demolding mechanics in imprint process”, Masayo Kayama, Hiroaki Kawata, Masaaki Yasuda and Yoshihiko Hirai, The 52nd Intern. Conf. on Electron, Ion, Photon Beam Technology and Nanofabrication, Portland, USA (2008)

-“The Dependence of Demolding Characteristics on Side Wall Roughness of Mold in Thermal Imprint”, Masayo Kayama and Hiroaki Kawata, The transactions of the Institute of Electrical Engineers of Japan, A publication of Sensors and Micromachines Society 128(8), 325-330, (2008)

-“InGaAsP / InAlAsP, Evaluation of MQW Layers”, Masayo Kayama and Yuichi Kawamura, The 70th Annual Meeting of the Japan Society of Applied Physics, Toyama Japan (2009)

-“Optical characterization of InGaAsP/InAlAsP multiple quantum wells grown by MBE for 1 μm wavelength region”, Masayo Kayama and Yuichi Kawamura, 22nd International Conference on Indium Phosphide and Related Materials (IPRM), Pages: 1 – 4, Kagawa Japan (2010)